Karim Inal

Professor

Discipline(s): Condensed Matter Physics, Nanosciences, Complex Systems, Electrical Engineering, Electronics, Electromagnetics, Photonics and Systems, Molecular Chemistry, Polymers, Process Engineering, Solid Mechanics
Topic(s): Additive Manufacturing, Circularity, Energy Efficiency, Industrial Sovereignty, Innovation and Design, Recycling, Strategic Metals, Sustainable Development

Keywords

Team

MSR - Métallurgie, Structure, Rhéologie

Biography

Karim Inal is a researcher specializing in microelectronics, advanced materials, and the reliability of semiconductor devices. His research focuses primarily on the study of mechanical and thermomechanical stresses in microelectronic structures, as well as on the impact of manufacturing processes on the performance and durability of components. His research addresses topics such as electromigration, the characterization of thin films (particularly silicon nitride and printed metal films), and the optimization of 3D interconnects using technologies such as *Through-Silicon Vias* (TSV). He also explores the mechanical and electrical properties of materials in relation to their microstructure, using advanced experimental methods such as Raman spectroscopy, nanoindentation, and integrated MOS or MEMS sensors. His contributions include the development of methodologies to evaluate residual stresses, model failures related to thermomechanical stresses, and propose solutions to improve device robustness in harsh environments.

Publication(s)

2018
Hypothetic impact of chemical bonding on the moisture resistance of amorphous SixNyHzby plasma-enhanced chemical vapor deposition DOI : 10.1051/metal/2018072
2016
Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts DOI : 10.1109/EPTC.2015.7412333
2015
Determination of the hardness of thin films with nanosized grains on flexible substrate for optimal interconnection with integrated circuit chips; [Détermination de la dureté de films à nano domaine sur substrat flexible pour l'optimisation de son interconnexion avec une puce] DOI : 10.1051/mattech/2015053
2015
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence DOI : 10.1016/j.microrel.2015.05.019
2015
Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method DOI : 10.1109/TCPMT.2015.2445099
2015
Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing DOI : 10.1109/EuroSimE.2015.7103140
2015
Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect DOI : 10.1016/j.microrel.2015.06.032
2015
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices DOI : 10.1016/j.microrel.2015.06.033
2014
Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras DOI : 10.1117/12.2049967
2014
Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers DOI : 10.1109/EuroSimE.2014.6813834
2014
Determination of material properties and failure using in-situ thermo-mechanical probe DOI : 10.1109/DTIP.2014.7056700
2014
Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation DOI : 10.4028/www.scientific.net/AMR.996.975
2014
From stress sensor towards back end of line embedded thermo-mechanical sensor DOI : 10.1016/j.mee.2013.12.013
2014
On the material depletion rate due to electromigration in a copper TSV structure DOI : 10.1109/IIRW.2014.7049523
2014
CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon DOI : 10.1109/EuroSimE.2014.6813808
2014
Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology DOI : 10.4028/www.scientific.net/AMR.996.930
2013
Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement DOI : 10.1109/Transducers.2013.6627267
2013
Mechanical behavior of flexible silicon devices curved in spherical configurations DOI : 10.1109/EuroSimE.2013.6529978
2013
Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis DOI : 10.1016/j.mee.2013.02.018
2013
First in operando SEM observation of electromigration-induced voids in TSV structures
2012
3D multi-stacking of thin dies based on TSV and micro-inserts interconnections DOI : 10.1109/ECTC.2012.6248965
2012
Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles DOI : 10.1007/s10853-012-6366-6
2012
Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics DOI : 10.1557/opl.2011.1264
2011
Nano indentation of ruthenium ultra thin film deposited on gold; [Nano indentation de couches dures ultra minces de ruthénium sur or] DOI : 10.1051/mattech/2011031
2011
Evaluation and optimization of die-shift in embedded wafer-level packaging by enhancing the adhesion strength of silicon chips to carrier wafer DOI : 10.1109/EPTC.2011.6184519
2011
Discrete analysis of gold surface asperities deformation under spherical nano-indentation towards electrical contact resistance calculation DOI : 10.1109/HOLM.2011.6034798
2011
Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation DOI : 10.1109/IITC.2011.5940351
2011
Microstructure evolution of gold thin films under spherical indentation for micro switch contact applications DOI : 10.1007/s10853-011-5575-8
2011
Thickness effect on microstructure and residual stress of annealed copper thin films DOI : 10.4028/www.scientific.net/MSF.681.139
2010
Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts DOI : 10.1109/HOLM.2010.5619563
2010
Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages DOI : 10.1109/ESTC.2010.5642997
2010
A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel DOI : 10.1016/j.jnucmat.2010.02.025
2010
Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications DOI : 10.1016/j.mee.2009.07.020
2010
Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues DOI : 10.1109/ESIME.2010.5464594
2010
Mechanical issues induced by electrical wafer sort: Correlations from actual tests, nanoindentation and 3D dynamic modeling DOI : 10.1109/ESTC.2010.5642863
2010
Selective image analysis for roughness characterisation DOI : 10.1179/175158310X12678019274129
2010
Residual stress estimation in damascene copper interconnects using embedded sensors DOI : 10.1016/j.mee.2009.05.017
2009
Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures DOI : 10.1016/j.msea.2009.08.020
2009
Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect DOI : 10.1016/j.ijplas.2007.11.004
2008
Numerical investigations of smart card module: Parametric analysis and design optimization DOI : 10.1109/TDMR.2008.2002347
2008
Mechanical stress sensors for copper damascene interconnects
2008
Micromechanical modeling of brittle fracture of french RPV steel. A comprehensive study of stress triaxiality effect DOI : 10.1115/PVP2008-61334
2007
Embedded sensors for mechanical stress monitoring in copper damascene interconnects DOI : 10.1109/ISDRS.2007.4422311
2006
Martensitic transformation criteria in Cu-Al-Be shape memory alloy-In situ analysis DOI : 10.1016/j.msea.2006.05.085
2006
Delayed cracking in 301LN austenitic steel after deep drawing: Martensitic transformation and residual stress analysis DOI : 10.1016/j.msea.2006.02.189
2006
Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steels DOI : 10.1111/j.1460-2695.2006.01056.x
2006
Microscale modelling of cleavage fracture at low temperatures: Influence of heterogeneities at the granular scale DOI : 10.1111/j.1460-2695.2006.01012.x
2005
Inter and intra granular strain analysis by microdiffraction Kossel DOI : 10.4028/0-87849-969-5.159
2005
Determination of residual stresses after tensile tests and deep drawing of unstable austenitic steel DOI : 10.4028/0-87849-969-5.690
2005
Dislocation density tensor identification by coupling micromechanics and X-ray diffraction line broadening DOI : 10.1016/j.msea.2005.02.079
2004
Periodic dislocation configuration analysis by lattice distortion evaluation: Micromechanical approach and X-ray diffraction line broadening DOI : 10.1107/S0021889804001748
2004
Analysis of the martensitic transformation at various scales in TRIP steel DOI : 10.1016/j.msea.2003.10.372
2004
Second-order stresses and strains heterogeneous steels: Self-consistent modeling and X-ray diffraction analysis DOI : 10.1007/s11661-006-0216-6
2004
Stress distribution and cleavage analysis in a 16MnNiMo5 bainitic steel X-ray diffraction and multiscale polycrystalline modelling
2004
Stress analysis of martensitic transformation in Cu-Al-Be polycrystalline and single-crystalline shape memory alloy DOI : 10.1016/j.msea.2003.10.348
2003
Stress distribution in the 16MND5 bainitic steel. Experimental analysis and polycrystalline modeling; [Distribution des contraintes dans l'acier bainitiqu 16MND5. Analyse expérimentale et modélisation polycristalline] DOI : 10.1016/S1296-2139(03)00075-7
2003
Transformation textures and stress distribution during martensitic transformation DOI : 10.1051/jp4:2003881
2003
Transformation textures in unstable austenitic steel DOI : 10.1115/1.1525249
2002
Dislocation microstructures identification by x-ray diffraction-line broadening analysis DOI : 10.4028/www.scientific.net/msf.404-407.133
2002
Stress distribution in unstable austenitic steel DOI : 10.4028/www.scientific.net/msf.404-407.495
2002
Individual grain analysis during martensitic transformation in a polycrystalline shape memory alloy: Relation between stresses and microstructure DOI : 10.4028/www.scientific.net/msf.404-407.483
2002
Internal stress analysis for the damage study of a 16MND5 bainitic steel DOI : 10.4028/www.scientific.net/msf.404-407.641
2001
Multi-scale behaviour modelling of an austeno-ferritic steel DOI : 10.1080/10238160108200145
2000
X-ray intergranular stresses analysis in a cast duplex stainless steel DOI : 10.4028/www.scientific.net/msf.347-349.247
2000
Evidence of second order stresses of plastic origin in Zircaloy-4 sheets
1999
Stress analysis in a duplex steel. X-ray diffraction methodologies of macro and pseudo-macro stress analysis in a textured duplex stainless steel
1997
Approches numériques et expérimentales du passage micro-macro dans des aciers austéno-ferritiques

Teaching

Materials for Engineers

Course Director

The in-person component (27 hours) is structured into plenary sessions in a lecture hall (12 hours), small-group sessions (12 hours) with fewer students, and presentations of lab reports to a panel (30 minutes). It also includes a written exam (2 hours and 30 minutes). Students’ independent work (18 hours) includes (in addition to the engine disassembly and reassembly mentioned above): A self-assessment multiple-choice quiz (30 min) on prerequisites. This self-assessment is conducted prior to the first class to identify students’ strengths and weaknesses and then focus on certain aspects during face-to-face instruction. An assignment on phase diagrams (2 hours) An assignment on material aging (2 hours) Laboratory work at the CMAT (6 hours): 13 lab sessions are conducted in groups of 4 to 5 students, supervised by the Center’s engineers and technicians as well as doctoral students, since most lab topics are related to current thesis projects. A 20-minute oral presentation for each lab is given at the end of the day in two parallel sessions. Students therefore complete one of the lab sessions and participate in or attend half of the presentations at the end of the day. Two similar days are organized to accommodate the entire class. Final exam review (5 hours)

PhD supervision

2023 Additive manufacturing by melt electrowriting of a piezoresistive device for embedded strain sensors OUATTARA Ladji Bafétégué
2021 Multi-scale organization of a piezoelectric PVDF/clay nanocomposite obtained by additive manufacturing. Impact of the electric field and evolution during deformation. PONS Nelly
2019 Study of the thermo-mechanical behavior and fracture of iron oxide at room temperature and high temperature. CLAVERIE Victor
2018 Contribution of micro-mechanical testing to the study of the plastic behavior of an anisotropic material - Micro-indentation, micro-pillar compression, and scratch testing PINHEIRO DE BRITO Larissa Raquel
2018 Study of the appearance of recrystallized grains in single-crystal nickel-based superalloys for turbine blade applications HAZEMANN Emile
2017 Increased efficiency of printed CZTSSe photovoltaic cells through optimization of the active layer's crystal structure and creation of a bandgap gradient across its thickness GIULIANO Laure
2015 New protective coating for thin-film resistive components CAZAKO Catheline