Karim Inal

Biographie

Publication(s)

• 2018
  Hypothetic impact of chemical bonding on the moisture resistance of amorphous SixNyHzby plasma-enhanced chemical vapor deposition DOI : 10.1051/metal/2018072
• 2016
  Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts DOI : 10.1109/EPTC.2015.7412333
• 2015
  Determination of the hardness of thin films with nanosized grains on flexible substrate for optimal interconnection with integrated circuit chips; [Détermination de la dureté de films à nano domaine sur substrat flexible pour l'optimisation de son interconnexion avec une puce] DOI : 10.1051/mattech/2015053
• 2015
  Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence DOI : 10.1016/j.microrel.2015.05.019
• 2015
  Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method DOI : 10.1109/TCPMT.2015.2445099
• 2015
  Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing DOI : 10.1109/EuroSimE.2015.7103140
• 2015
  Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect DOI : 10.1016/j.microrel.2015.06.032
• 2015
  Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices DOI : 10.1016/j.microrel.2015.06.033
• 2014
  Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras DOI : 10.1117/12.2049967
• 2014
  Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers DOI : 10.1109/EuroSimE.2014.6813834
• 2014
  Determination of material properties and failure using in-situ thermo-mechanical probe DOI : 10.1109/DTIP.2014.7056700
• 2014
  Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation DOI : 10.4028/www.scientific.net/AMR.996.975
• 2014
  From stress sensor towards back end of line embedded thermo-mechanical sensor DOI : 10.1016/j.mee.2013.12.013
• 2014
  On the material depletion rate due to electromigration in a copper TSV structure DOI : 10.1109/IIRW.2014.7049523
• 2014
  CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon DOI : 10.1109/EuroSimE.2014.6813808
• 2014
  Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology DOI : 10.4028/www.scientific.net/AMR.996.930
• 2013
  Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement DOI : 10.1109/Transducers.2013.6627267
• 2013
  Mechanical behavior of flexible silicon devices curved in spherical configurations DOI : 10.1109/EuroSimE.2013.6529978
• 2013
  Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis DOI : 10.1016/j.mee.2013.02.018
• 2013
  First in operando SEM observation of electromigration-induced voids in TSV structures
• 2012
  3D multi-stacking of thin dies based on TSV and micro-inserts interconnections DOI : 10.1109/ECTC.2012.6248965
• 2012
  Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles DOI : 10.1007/s10853-012-6366-6
• 2012
  Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics DOI : 10.1557/opl.2011.1264
• 2011
  Nano indentation of ruthenium ultra thin film deposited on gold; [Nano indentation de couches dures ultra minces de ruthénium sur or] DOI : 10.1051/mattech/2011031
• 2011
  Evaluation and optimization of die-shift in embedded wafer-level packaging by enhancing the adhesion strength of silicon chips to carrier wafer DOI : 10.1109/EPTC.2011.6184519
• 2011
  Discrete analysis of gold surface asperities deformation under spherical nano-indentation towards electrical contact resistance calculation DOI : 10.1109/HOLM.2011.6034798
• 2011
  Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation DOI : 10.1109/IITC.2011.5940351
• 2011
  Microstructure evolution of gold thin films under spherical indentation for micro switch contact applications DOI : 10.1007/s10853-011-5575-8
• 2011
  Thickness effect on microstructure and residual stress of annealed copper thin films DOI : 10.4028/www.scientific.net/MSF.681.139
• 2010
  Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts DOI : 10.1109/HOLM.2010.5619563
• 2010
  Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages DOI : 10.1109/ESTC.2010.5642997
• 2010
  A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel DOI : 10.1016/j.jnucmat.2010.02.025
• 2010
  Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications DOI : 10.1016/j.mee.2009.07.020
• 2010
  Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues DOI : 10.1109/ESIME.2010.5464594
• 2010
  Mechanical issues induced by electrical wafer sort: Correlations from actual tests, nanoindentation and 3D dynamic modeling DOI : 10.1109/ESTC.2010.5642863
• 2010
  Selective image analysis for roughness characterisation DOI : 10.1179/175158310X12678019274129
• 2010
  Residual stress estimation in damascene copper interconnects using embedded sensors DOI : 10.1016/j.mee.2009.05.017
• 2009
  Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures DOI : 10.1016/j.msea.2009.08.020
• 2009
  Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect DOI : 10.1016/j.ijplas.2007.11.004
• 2008
  Numerical investigations of smart card module: Parametric analysis and design optimization DOI : 10.1109/TDMR.2008.2002347
• 2008
  Mechanical stress sensors for copper damascene interconnects
• 2008
  Micromechanical modeling of brittle fracture of french RPV steel. A comprehensive study of stress triaxiality effect DOI : 10.1115/PVP2008-61334
• 2007
  Embedded sensors for mechanical stress monitoring in copper damascene interconnects DOI : 10.1109/ISDRS.2007.4422311
• 2006
  Martensitic transformation criteria in Cu-Al-Be shape memory alloy-In situ analysis DOI : 10.1016/j.msea.2006.05.085
• 2006
  Delayed cracking in 301LN austenitic steel after deep drawing: Martensitic transformation and residual stress analysis DOI : 10.1016/j.msea.2006.02.189
• 2006
  Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steels DOI : 10.1111/j.1460-2695.2006.01056.x
• 2006
  Microscale modelling of cleavage fracture at low temperatures: Influence of heterogeneities at the granular scale DOI : 10.1111/j.1460-2695.2006.01012.x
• 2005
  Inter and intra granular strain analysis by microdiffraction Kossel DOI : 10.4028/0-87849-969-5.159
• 2005
  Determination of residual stresses after tensile tests and deep drawing of unstable austenitic steel DOI : 10.4028/0-87849-969-5.690
• 2005
  Dislocation density tensor identification by coupling micromechanics and X-ray diffraction line broadening DOI : 10.1016/j.msea.2005.02.079
• 2004
  Periodic dislocation configuration analysis by lattice distortion evaluation: Micromechanical approach and X-ray diffraction line broadening DOI : 10.1107/S0021889804001748
• 2004
  Analysis of the martensitic transformation at various scales in TRIP steel DOI : 10.1016/j.msea.2003.10.372
• 2004
  Second-order stresses and strains heterogeneous steels: Self-consistent modeling and X-ray diffraction analysis DOI : 10.1007/s11661-006-0216-6
• 2004
  Stress distribution and cleavage analysis in a 16MnNiMo5 bainitic steel X-ray diffraction and multiscale polycrystalline modelling
• 2004
  Stress analysis of martensitic transformation in Cu-Al-Be polycrystalline and single-crystalline shape memory alloy DOI : 10.1016/j.msea.2003.10.348
• 2003
  Stress distribution in the 16MND5 bainitic steel. Experimental analysis and polycrystalline modeling; [Distribution des contraintes dans l'acier bainitiqu 16MND5. Analyse expérimentale et modélisation polycristalline] DOI : 10.1016/S1296-2139(03)00075-7
• 2003
  Transformation textures and stress distribution during martensitic transformation DOI : 10.1051/jp4:2003881
• 2003
  Transformation textures in unstable austenitic steel DOI : 10.1115/1.1525249
• 2002
  Dislocation microstructures identification by x-ray diffraction-line broadening analysis DOI : 10.4028/www.scientific.net/msf.404-407.133
• 2002
  Stress distribution in unstable austenitic steel DOI : 10.4028/www.scientific.net/msf.404-407.495
• 2002
  Individual grain analysis during martensitic transformation in a polycrystalline shape memory alloy: Relation between stresses and microstructure DOI : 10.4028/www.scientific.net/msf.404-407.483
• 2002
  Internal stress analysis for the damage study of a 16MND5 bainitic steel DOI : 10.4028/www.scientific.net/msf.404-407.641
• 2001
  Multi-scale behaviour modelling of an austeno-ferritic steel DOI : 10.1080/10238160108200145
• 2000
  X-ray intergranular stresses analysis in a cast duplex stainless steel DOI : 10.4028/www.scientific.net/msf.347-349.247
• 2000
  Evidence of second order stresses of plastic origin in Zircaloy-4 sheets
• 1999
  Stress analysis in a duplex steel. X-ray diffraction methodologies of macro and pseudo-macro stress analysis in a textured duplex stainless steel
• 1997
  Approches numériques et expérimentales du passage micro-macro dans des aciers austéno-ferritiques

Enseignements

Direction(s) de thèse(s)

• 2023 Fabrication additive par filament melt electrowriting d’un dispositif piézorésistif pour capteurs de contraintes embarqués OUATTARA Ladji Bafétégué
• 2021 Organisation multi-échelle d'un nanocomposite PVDF/Argile piézoélectrique obtenue par fabrication additive. Impact du champ électrique et évolution en cours de déformation. PONS Nelly
• 2019 Etude du comportement thermo-mécanique et de la rupture d’oxyde de fer à température ambiante et à haute température. CLAVERIE Victor
• 2018 Contribution des essais micro-mécaniques à l'étude du comportement plastique d'un matériau anisotrope -Micro-indentation, compression de micro-piliers et rayure PINHEIRO DE BRITO Larissa Raquel
• 2018 Etude d'apparition de grains recristallisés dans les superalliages base nickel monocristallins pour application aux aubes de turbine HAZEMANN Emile
• 2017 Augmentation de l'efficacité de cellules photovoltaïques CZTSSe imprimées, par l'optimisation de la structure cristalline de la couche active et la création d'un gradient de bande interdite dans son épaisseur GIULIANO Laure
• 2015 Nouveau revêtement de protection pour composants résistifs à couches minces CAZAKO Catheline